Samtec 224/448 Gbps at DesignCon 2026

Samtec consistently makes a significant impact at major industry events. DesignCon 2026 was no exception. Their technical presentations drew high-profile experts. But the real action happened on the show floor through live product demonstrations. This article explores how Samtec is pushing the next frontier of data speeds: 224 and 448 gigabits per second (Gbps).

The Critical Role of 224/448 Gbps Data Rates

Why is the industry racing to these speeds? 224/448 Gbps data rates mark major inflection points. They set the maximum data that can move through a single path. That path could be a connector pin, PCB trace, cable, or optical fiber. This matters most in dense interconnects for AI systems, network switches, and advanced multi-chip packages.

Getting this right unlocks key benefits:

• Enables higher-capacity systems: Supports 1.6T and 3.2T systems without an impractical increase in data lanes.
• Reduces system complexity: Moving from 112G to 224G per lane can cut required lanes, traces, connectors, and re-timing chips for the same bandwidth.
• Alleviates data bottlenecks: In AI and HPC, data movement between GPUs, memory, and storage often limits performance. Faster links directly reduce the I/O bottleneck.
• Improves power efficiency: The goal is to lower energy per transmitted bit as system density rises.

Reaching these speeds is extremely challenging. They push electrical channels to their physical limits. Engineers must consider options such as advanced copper cables, co-packaged optics (CPO), and linear-drive pluggable optics (LPO). As speeds rise, traditional PCB traces become less effective. Samtec’s DesignCon demos show practical ways to solve these problems.

Unveiling the 130 GHz Test Platform: The BE130 Bulls Eye

A centerpiece of Samtec’s showcase was the BE130 Bulls Eye® test platform. It delivers 130 GHz of bandwidth through coaxial test cables. It is built to characterize next-generation devices, circuit boards, and semiconductor packages.

That performance is essential for components targeting 224/448 Gbps systems. The use cases go beyond computing. They include high-speed digital validation, AI/ML hardware testing, wafer probing, and advanced communications such as satellite and phased-array radar.

The Bulls Eye assembly uses a high-density, space-saving design. It enables smaller test boards and shorter electrical paths. That helps reduce interference and improves measurement accuracy. It also supports more reliable high-speed channels.

Collaborative Demo: 224/448 Gbps Test Platforms with Keysight

Samtec partnered with Keysight to show an end-to-end solution. The demo paired the BE130 test platform with Keysight’s 250 GHz Vector Network Analyzer (VNA).

Keysight emphasized the VNA’s high resolution. It helps engineers find subtle signal-integrity issues in tiny structures. These include features used in co-packaged optics and advanced packages. The joint setup measured beyond 130 GHz. It also validated a test platform for next-generation 448 Gbps applications over copper or optical links.

Live Demonstration: A 448 Gbps Co-Packaged Copper Channel

One of the most striking demos was a co-packaged copper (CPC) prototype. It simulated a direct, ultra-high-speed connection between GPUs inside a server tray. The system ran at 448 Gbps.

Keysight’s VNA measured signal performance. A 448 Gbps signal traveled through a Samtec Nitrowave® LL130 RF cable. It then passed into precision connectors and across a short PCB segment. Next it moved through the Samtec Si-Fly® HD connector system. The connectors were linked by 400 mm of EyeSpeed® Hyper Low Skew cables (shown in blue above). These cables help preserve timing integrity. Finally, the signal looped back for analysis. The prototype demonstrated a practical path to 448 Gbps copper interconnects.

Conclusion and Further Resources

These live demonstrations made 224/448 Gbps performance tangible at DesignCon 2026. They showed clear progress toward overcoming barriers in next-generation data center, AI, and networking infrastructure.