作者： Tom White
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Is the NPU Enough? 5 Real AI Laptop Workload Tests (2026)
Introduction: Beyond the ̶…
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INT8 vs FP8 vs Mixed Precision: Edge AI Quantization for AI PCs
Introduction: The Edge AI Effi…
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CES 2026: AI PC Shift to Local Memory & Efficiency
The narrative at CES 2026 has …
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Multi-Vendor Chiplets: ‘Interchangeable’ vs. ‘Connectable’
The release of the UCIe 3.0 sp…
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Chiplet Economics: When SoC Disaggregation Costs More
1. Introduction: The Counter-I…
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UCIe 3.0 Verification: PHY, Packaging & Test Guide (2026)
The release of the UCIe 3.0 sp…
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CPO & 1.6T: Breaking AI Switch Heat & Power Limits
1. Introduction: The 1.6T Infl…
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CXL 3.x Memory Pooling: Rack Deployment Challenges
The data center architecture i…
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PCIe 7.0 at 128 GT/s: Interconnects & Memory Pooling
Introduction: The Dawn of the …
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Glass Core Substrate: Solving Warpage & I/O in Packaging
1. Introduction: The “Gl…